Printed Circuit Board Bending Test Jig

Evaluation of Bending Strength of Electronic Components and Printed Circuit Boards

Evaluation of Bending Strength of Electronic Components and Substrates

Features

Can perform 3- and 4-point testing of Substrates.
Can measure resistance values while simultaneously measuring Substrate strength. (optional)

Can calculate critical bending and other test parameters.

Can perform cycle bending test.

{"title":"Downloads","description":"Download the latest brochure.","source":"product","key":3452,"max":30,"filter_types":["brochures"],"link_title":"View other Downloads","link_url":"","pdf_links":[]} {"title":"Applications","source":"product","key":3452,"max":3,"filter_types":["applications","application_note","posters"],"link_title":"Learn more","link_url":false,"config_list":[],"page_links":[],"column_title":"Documents"} {"title":"Technical Documents","source":"product","key":3452,"max":3,"filter_types":["technical","technical_reports","white_papers","primers"],"link_title":"Learn more","link_url":"#tbaleAnchor_technical","config_list":[],"page_links":[],"column_title":"Documents"} {"title":"Manuals","source":"product","key":3452,"max":3,"filter_types":["manuals"],"link_title":"Learn more","link_url":"#tbaleAnchor_manual","config_list":[],"page_links":[],"column_title":"Documents"}

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